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Machine Learning Research
for a Smarter Future

Advancing high-quality research in machine learning, artificial intelligence and intelligent computational technologies.

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Most Cited Articles

RESEARCH IMPACT

Highly Cited Articles

Discover highly cited research published in SIJML.

01
Dimensions Affecting Consumer Acceptance towards Artificial Intelligence (AI) Service in the Food and Beverage Industry in Klang Valley
02
Artificial Intelligence and Islam: A Bibliometric-Thematic Analysis and Future Research Direction
03
Delving into the Revolutionary Impact of Artificial Intelligence on Mechanical Systems: A Review
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THE PUBLISHER

Semarak Ilmu Sdn Bhd
Semarak Ilmu Sdn Bhd
Share Your Knowledge for a Better Tomorrow

AIMS AND SCOPE

The Semarak International Journal of Machine Learning (SIJML) is an international peer-reviewed journal dedicated to advancing research, innovation, and practical applications in machine learning and artificial intelligence.

The journal provides a platform for researchers, academics, practitioners, and industry professionals to disseminate original research and emerging developments in intelligent computational methods and data-driven technologies.

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SUBMISSION

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Share your latest research with the international machine learning community.
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EDITORIAL ENQUIRIES
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INDEXING AND ABSTRACTING

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PUBLISHING STANDARDS
Open Access
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Creative Commons BY-NC 4.0
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SIJML is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License .
SEMARAK INTERNATIONAL JOURNAL
Semarak International Journal of Machine Learning
Advancing research and innovation in machine learning, artificial intelligence and intelligent computational technologies.
ISSN (Online): 3030-5241
INFORMATION
For Readers → For Authors → For Librarians → About the Journal → Editorial Team →
PUBLISHER
Semarak Ilmu Publishing
No. 2-1, Jalan Puteri 3A/3,
Bandar Puteri Bangi,
43000 Kajang, Selangor,
Malaysia
Editorial: editorial@sijml.com
 
© Semarak International Journal of Machine Learning
Published by Semarak Ilmu Publishing
Open Access · CC BY-NC 4.0
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